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POWERMITEPower 表面贴装封装 该肖特基整流器运用肖特基势垒原理,采用势垒金属和外延结构,可产生优化的正向压降-逆向电流权衡。这种先进的封装技术可用于实现高能效的微型、节省空间的表面贴装整流器。由于其独特的散热设计,Powermite 具有与 SMA 相同的热性能,而占位减小 50%,高度外形 < 1.1 mm,是业内高度外形最小的整流器之一。由于其尺寸小巧,因而适用于蜂窝电话和无绳电话、充电器、笔记本电脑、打印机、PDA 和 PCMCIA 卡等便携式和电池供电产品。典型应用为 AC-DC 和 DC-DC 转换器、逆向电池保护和多个供应电压的“OR”运行,以及性能和尺寸性能至关重要的其他应用。
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状态
CAD Models
Compliance
Package Type
Case Outline
MSL Type
MSL Temp (°C)
Container Type
Container Qty.
ON Target
Configuration
VRRM Min (V)
VF Max (V)
IRM Max (µA)
IO(rec) Max (A)
IFSM Max (A)
trr Max (ns)
Cj Max (pF)
Reference Price
MBRM110ET1
More Details
MBRM110ET1G
Pb
A
H
P
POWERMITE-2
1
260
REEL
3000
N
Single
10
0.53
1
1
50
-
-
Price N/A
More Details
MBRM110ET3
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MBRM110ET3G
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可靠性数据
Die Related Summary Data
Device: MBRM110ET1G
Equivalent to wafer fab process: RECT
产品技术
产品技术
等效器件小时
平均故障间隔时间/平均无故障时间(按小时计算)
FITS
RECT
3
19108175705
2860170968
0.35
More Details
Re-calculate Data
Data is based on the following assumptions.
Note: The temperature and confidence level may be adjusted to your requirements.
Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)
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