Material Composition

Locate Pb-free (RoHS) and Green Material content details.

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1  Non-hybrid  devices found

Non-hybrid devices

Base part Part Status HF Exemptions Excel IPC1752 PDF IPC175X XML IPC1752A XML  Mold Compound-Black   Lead Frame   Die Attach   Plating   Die   Wire Bond - Au   TOTAL 
Epoxy resin
[%] 		Phenolic Resin
[%] 		Ortho Cresol Novolac Resin
[%] 		Carbon Black (C)
[%] 		Fused Silica (SiO2)
[%] 		Weight
[mg] 		Magnesium (Mg)
[%] 		Silicon (Si)
[%] 		Nickel (Ni)
[%] 		Copper (Cu)
[%] 		Weight
[mg] 		Epoxy resin
[%] 		Silver (Ag)
[%] 		Weight
[mg] 		Tin (Sn)
[%] 		Weight
[mg] 		Silicon (Si)
[%] 		Weight
[mg] 		Gold (Au)
[%] 		Weight
[mg] 		Weight
[mg]
proprietary data proprietary data 29690-82-2 1333-86-4 60676-86-0 n/a 7439-95-4 7440-21-3 7440-02-0 7440-50-8 n/a proprietary data 7440-22-4 n/a 7440-31-5 n/a 7440-21-3 n/a 7440-57-5 n/a n/a
N25S818HA N25S818HAT21I Active  Y   Download xls Download xml Download xml Download xml  5.0   2.0   2.5   0.5   90.0   19.11   0.15   0.65   3.0   96.2   10.6   20.0   80.0   0.9   100.0   0.44   100.0   1.65   100.0   0.22   32.92 

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