Material Composition

Locate Pb-free (RoHS) and Green Material content details.

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1  Non-hybrid  devices found

Non-hybrid devices

Base part Part Status HF Exemptions Excel IPC1752 PDF IPC175X XML IPC1752A XML  Mold Compound-Black   Lead Frame   Die Attach   Plating   Die   Wire Bond - Au   TOTAL 
Epoxy resin
[%] 		Phenolic Resin
[%] 		Ortho Cresol Novolac Resin
[%] 		Carbon Black (C)
[%] 		Fused Silica (SiO2)
[%] 		Weight
[mg] 		Zinc (Zn)
[%] 		Iron (Fe)
[%] 		Copper (Cu)
[%] 		Phosphorus (P)
[%] 		Weight
[mg] 		Epoxized Condensate Of Para-Hydrobenzaldehyde And Alkyl Phenol
[%] 		Silver (Ag)
[%] 		Weight
[mg] 		Tin (Sn)
[%] 		Weight
[mg] 		Silicon (Si)
[%] 		Weight
[mg] 		Gold (Au)
[%] 		Weight
[mg] 		Weight
[mg]
proprietary data proprietary data 29690-82-2 1333-86-4 60676-86-0 n/a 7440-66-6 7439-89-6 7440-50-8 7723-14-0 n/a 129915-35-1 7440-22-4 n/a 7440-31-5 n/a 7440-21-3 n/a 7440-57-5 n/a n/a
N25S830HA N25S830HAS22I Active  Y   Download xls Download xml Download xml Download xml  5.0   5.0   2.0   0.5   87.5   46.29   0.1   2.3   97.5   0.1   29.12   23.0   77.0   1.25   100.0   0.96   100.0   3.89   100.0   0.27   81.78 

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