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公司介绍
NSM4002MR6T1G 包含两个 NPN 晶体管。Q2 NPN 晶体管的基座与 Q1 NPN 晶体管的集极内部联接。此器件将两个组件集成到一个器件中,用于替代提供恒定电流常用的分立方案。NSM4002MR6T1G 采用 SC-74 封装,适用于空间受限的表面贴装应用。
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CAD Models
Compliance
Package Type
Case Outline
MSL Type
MSL Temp (°C)
Container Type
Container Qty.
ON Target
Polarity
Type
VCE(sat) Max (V)
IC Cont. (A)
VCEO Min (V)
VCBO (V)
VEBO (V)
VBE(sat) (V)
VBE(on) (V)
hFE Min
hFE Max
fT Min (MHz)
PTM Max (W)
Reference Price
NSM4002MR6T1G
Active
Pb
A
H
P
SC-74
1
260
REEL
3000
Y
NPN
General Purpose
0.3
200-Q1 500-Q2
40
60
6
-
1.2
100
300
300
-
$0.0876
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可靠性数据
Die Related Summary Data
Device: NSM4002MR6T1G
Equivalent to wafer fab process: SST
产品技术
产品技术
等效器件小时
平均故障间隔时间/平均无故障时间(按小时计算)
FITS
SST
0
4654891639
More Details
Re-calculate Data
Data is based on the following assumptions.
Note: The temperature and confidence level may be adjusted to your requirements.
Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)
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