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公司介绍
这款肖特基整流器运用肖特基势垒原理,采用势垒金属,可产生优化的正向压降和反向电流平衡。这款器件适用于低电压、高频率整流,或注重紧凑尺寸和重量的续流和极性保护二极管的表面贴装应用。封装方式还可选则无引线34 MELF封装。
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CAD Models
Compliance
Package Type
Case Outline
MSL Type
MSL Temp (°C)
Container Type
Container Qty.
ON Target
Configuration
VRRM Min (V)
VF Max (V)
IRM Max (µA)
IO(rec) Max (A)
IFSM Max (A)
trr Max (ns)
Cj Max (pF)
Reference Price
MBR0540T1
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MBR0540T1G
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可靠性数据
Die Related Summary Data
Device: MBR0540T1G
Equivalent to wafer fab process: RECT
产品技术
产品技术
等效器件小时
平均故障间隔时间/平均无故障时间(按小时计算)
FITS
RECT
3
19108175705
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Re-calculate Data
Data is based on the following assumptions.
Note: The temperature and confidence level may be adjusted to your requirements.
Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)
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