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公司介绍
FOD0721/0720/0710 系列利用安森美半导体的专利共面封装技术 Optoplanar 和优化的集成电路设计,可实现最低 20 kV/μs 的共模干扰抑制 (CMR) 等级。此类高速逻辑门极光耦合器由与 CMOS 检测器集成电路耦合的 CMOS 集成电路驱动的高速 AlGaAs LED 组成,该检测器集成电路包括集成光电二极管、高速互阻抗放大器和带有输出驱动器的电压比较器。该 CMOS 技术与高能效 LED 进行耦合,实现了低能耗以及极高速(40ns 传播延迟、6ns 脉冲宽度失真)。此类器件采用紧凑型 8 引脚小外形封装。
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VCC (Max) (V)
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IFT (Max) (mA)
VOL (Max) (V)
ICCL (Max) (mA)
tPHL (Max) (ns)
tPLH (Max) (ns)
PWD (Max) (ns)
CMR (Max) (kV/µs)
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FOD0720
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FOD0720R2
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可靠性数据
Die Related Summary Data
Device: FOD0720
Equivalent to wafer fab process: BB,GA
产品技术
产品技术
等效器件小时
平均故障间隔时间/平均无故障时间(按小时计算)
FITS
BB,GA
0
58865369
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Re-calculate Data
Data is based on the following assumptions.
Note: The temperature and confidence level may be adjusted to your requirements.
Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)
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