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FOD0721/0720/0710系列采用飞兆专有的共面封装技术Optoplanar,并优化了IC设计,以保证共模噪声抑制(CMR)最小额定值为20kV/μs。
这些高速逻辑门光耦合器包含一个高速砷化铝镓LED,它由一个耦合到CMOS探测器IC(包括一个集成式光电二极管、一个高速跨导放大器、一个带输出驱动器的电压比较器)的CMOS IC驱动。 耦合到高效率LED的CMOS技术可实现低功耗以及非常高的速度(传播延迟为40ns,脉宽失真度为6ns)。
这些器件采用紧凑型8引脚小尺寸封装。
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MSL Temp (°C)
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VCC (Max) (V)
VCC (Min) (V)
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IFT (Max) (mA)
VOL (Max) (V)
ICCL (Max) (mA)
tPHL (Max) (ns)
tPLH (Max) (ns)
PWD (Max) (ns)
CMR (Max) (kV/µs)
VISO (Min) (V)
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FOD0721
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FOD0721R2
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可靠性数据
Die Related Summary Data
Device: FOD0721
Equivalent to wafer fab process: BB,GA
产品技术
产品技术
等效器件小时
平均故障间隔时间/平均无故障时间(按小时计算)
FITS
BB,GA
0
58865369
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Re-calculate Data
Data is based on the following assumptions.
Note: The temperature and confidence level may be adjusted to your requirements.
Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)