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FUSB302B 的目标用户为希望以较少的编程量实施 DRP/SRC/SNK USB Type-C 接头的系统设计人员。FUSB302B 实现了 USB Type-C 检测,包括连接和定向。FUSB302B 集成了 USB BMC 功率输送协议的物理层,可实现高达 100 W 的电源和角色互换。BMC PD 装置实现了对于符合 C 型规范的其他接口的完全支持。参考法规可用于 FUSB302B 在若干嵌入控制器平台之间轻松实施 C 型 和 USB BMC 功率输送协议。单击下面的“软件”链接。
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FUSB302B01MPX
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FUSB302B10MPX
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FUSB302B11MPX
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FUSB302BMPX
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FUSB302BUCX
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Die Related Summary Data
Device: FUSB302B01MPX
Equivalent to wafer fab process: BD
产品技术
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等效器件小时
平均故障间隔时间/平均无故障时间(按小时计算)
FITS
BD
0
1595257088
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Data is based on the following assumptions.
Note: The temperature and confidence level may be adjusted to your requirements.
Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)
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