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该 XS™ DrMOS 系列是安森美半导体下一代、全优化、超紧凑型集成式 MOSFET 和驱动器功率级方案,用于高电流、高频率、同步降压、DC-DC 应用。FDMF6820C 在一个热管理增强的、超紧凑型 6x6mm 封装内集成了一个驱动集成电路和一个自举肖特基二极管。通过集成方式,该完整开关功率级针对驱动器和 MOSFET 动态性能、系统电感和功率 MOSFET RDS(ON) 进行了优化。该 XS™ DrMOS 系列使用安森美半导体的高性能 PowerTrench® MOSFET 技术,大幅降低了开关振铃,不再需要大多数降压转换器应用中的吸收电路。减少了死区时间和传播延迟的驱动集成电路进一步增强了性能。温度警告功能会针对潜在的超温情况发出警告。FDMF6820A 结合了跳过模式 (SMOD#),可提高轻负载下的能效。FDMF6820C 也提供 3 态 3.3V PWM 输入,从而与多种 PWM 控制器兼容。
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FDMF6820C
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可靠性数据
Die Related Summary Data
Device: FDMF6820C
Equivalent to wafer fab process: GK,RN,U4
产品技术
产品技术
等效器件小时
平均故障间隔时间/平均无故障时间(按小时计算)
FITS
GK,RN,U4
0
108100566
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Data is based on the following assumptions.
Note: The temperature and confidence level may be adjusted to your requirements.
Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)
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