Burlington, Canada

生产工厂

组装、测试工厂,各配备10,000平方英尺(约合929平方米)洁净室空间,总面积94,000平方英尺(约合8,733平方米)。

组装/测试出产:
  • 微型SiP, 混合模块和采用3D芯片堆栈技术的MCM
成立背景:
  • 于2010年收购Sound Design Technologies后取得
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